Rapidly evolving digital technologies such as the IoT, cloud and AI overrun classical industries, such as automotive, which have longer innovation and development cycles. The current trend of interconnecting cars with local infrastructure and cloud backends opens large potentials for data-driven applications, enhanced user experience, and new business models but also needs to consider privacy of the users inside the vehicle and others, just observed in the streets. This becomes especially critical with respect to GDPR. Goal of AUTOPSY is to create a better understanding of the data flows in automotive environments in the light of GDPR and create a privacy-aware system model for an automotive use-case to address various aspects of GDPR in specific technical designs. The technology of tainting will be applied to separate communication streams between the sensor and multiple parties accessing and processing the data with different privileges. AUTOPSY aims to design a dynamic and scalable end to end infrastructure that protects the data with lightweight privacy preserving techniques onboard the vehicle. Across the expertise of the different partners, the practical feasibility is demonstrated by modifying a resource constrained TCU with an implementation of the privacy-preserving techniques and evaluating its communication on the one hand, and the interaction with a cloud backend on the other. Bringing together one applied research partner and one automotive supplier from each country combines domain know-how and technological competencies to address the problem, develop new technologies and later enable new transnational services for customers. Transnational dissemination activities and the exchange of young researchers complement the research. To have privacy preserving techniques by design close to deployment in new cars in 2030 requires to start now and bring project results in the specification of the new automotive architectures in 2023-2024, which coincides with the earliest end of the project.

The WAKEMEUP project objective is to set-up a pilot line for advanced microcontrollers with embedded non-volatile memory, design and manufacturing for the prototyping of innovative applications for the smart mobility and smart society domains. The already defined microcontrollers with 40nm embedded flash technology will be consolidated to build a solid manufacturing platform. Additional developments will be performed for the integration of memory, power management, connectivity, hard security on the same chip. The project will also target the industrialization of the embedded Phase Change Memory (PCM) technology built on top of the FDSOI 28nm logic process pilot line. The development of the ePCM will be driven by the final application requirements as well as decreasing the power consumption. The alternative memory solutions will be also studied as they have different - and complementary - traits in such areas as read/write speed, power and energy consumption, retention and endurance, and device density and benchmarked with the ePCM and the conventional eFlash. Continued advances in materials, device physics, architectures and design could further reduce the energy consumption of these memories. To achieve this goal of generating high value added semiconductor circuits in Europe in a breakthrough leading edge technology the project will deploy all the necessary activities to bring a new technology to an early industrial maturity stage. These activities encompass such developments as: technology enhancements for various specific application requirements such as wide temperature range and reliability, high security requests, high flexibility…, design enablment allowing first time silicon success, prototyping demonstrator products in the different application areas. In the WAKEMEUP project, new devices and systems will be developed by the application partners in automotive and secure based on FD-SOI and embedded digital technology to answer specific applications needs.

The main objective of the project is to develop a Smart solution for connecting process and material characteristics to achieve a new generation of digital materials in the automotive industry demonstrated by developing a new brake system with an anchor at least 12.5 % lighter and a housing with 10% improved machinability. The new developed solution will reach in next five years to the 35% of the European iron foundry market, 10% of the Worldwide level iron foundry market. A new smart data management module “DigiMAT module” will be developed by one SME specialized in ICT solutions. Its development will be supported by a sensor network and an advanced data management system already running in the iron foundry company. This smart module will consist on a specific algorithm for each digital material development combined with an automatic protocol definitions system that will conform a specific methodology. It will acquire, store, process and analyze data coming from a previously defined set of trials. . Its validation will be completed with the homologation of new digital materials by the TIER 1 company and by their introduction in the foundry company portfolio. In parallel the TIER 1 company will develop a lighter anchor based on the developed high yield material. This lighter anchor integrated into a new brake system will be functionally homologated by the TIER 1 and final user (OEM). Finally, partners will commonly develop a business plan for quick take up of the project results. Digital materials can have a wide impact in industry and society. First stage will report significant business opportunities to ICT companies and increase turnover of Tier 1 in the brake area of the automotive sector(+30%). The potential application to all type of material can render in significant global weight reduction in transport media and more sustainable development of industrial processes.

SeCoIIA aims at securing digital transition of manufacturing industry towards more connected, collaborative, flexible and automated production techniques. It fosters user-driven application cases from aeronautics, automotive and naval construction sectors. Collaboration is considered from Organization to Organization (O2O), but also from Machine to Machine (M2M), Machine to Human (M2H) and Human to Human (H2H) perspectives. Enhanced process monitoring, optimization and control is achieved by intelligent use digital twin technology, Industrial IoT, Cloud Manufacturing (CMfg), collaborative robotics and Industrial AI. The collaborative approach triggers a virtuous cycle of growth and innovation, irrigating the full value chain, from very large to very small actors. Now reaching this step requires due diligence to security implications. The transition from hierarchized supply chains to collaborative networks of smart factories opens an attack surface so far never reached. Manufacturing operators are untrained to the manipulation of vulnerable cyber-physical assets. The deployment of smart sensors over distributed shop floors requires time sensitive communication security measures. Enhanced collaboration on manufacturing activities may not safely apply without collaborative security monitoring and incident response. Last but not least, the increased reliance on machine-learning based decision making sets a technical challenge in terms of security assurance and a legal challenge in terms of accountability and law enforcement. These are the challenges that SeCoIIA intends to address through the development of 12 key capabilities which will be assessed in various configurations through 3 ambitious demonstration campaigns lead by pilot users. With 4 large strategic industry players, 4 highly innovative SMEs and 4 highly recognized research centres, SeCoIIA consortium is best suited to achieve enhanced competitiveness and resilience for European manufacturing industry.