The 14AMI project is about creating technological solutions for the 14 Angstrom CMOS technology node, including a fully integrated functional CFET (Complementary Field Effect Transistor) as new active CMOS device, and state-of-the-art holistic metrology techniques for both wafer and mask inspection and review. All is aimed to keep the pace in the industry to follow “Moore’s law”. The project addresses the following 3 main pillars that are relevant in enabling manufacture of 14A technology, 1) lithography, 2) metrology and 3) process module integration. In lithography the aim is to realize solutions for the 0.55NA EUV scanner platform to secure 14Angstrom node compliance in performance, that is, resolution, alignment, throughput and optics lifetime. In Metrology the objective is to cover wafer and mask metrology and quality control. The aim is to develop holistic metrology, tools & methods and data analytics to improve overlay, CD and focus measurement and quality control with a Precision to Tolerance, P/T, ratio between 0.1 and 0.3. In process module integration work covers the realization and demonstration of a CFET – Complementary Field Effect Transistor - CMOS device. Three options will be investigated for integration; a monolithic, sequential and a hybrid solution. In addition, the partners will develop a PFAS-free photo resist to reduce the ecological footprint of photolithography processes, and a smart AI based sensor technology to improve vacuum chambers' efficiency and reduce waste. At societal level the expected impact of the 14AMI project will support the partners and their supplier network to stay at the leading edge of high-tech developments, crucial to meet the digitization challenges of the European society. Moreover, 14AMI will “boost industrial competitiveness”, and attract talent in Europe, while enabling new application in areas such as security, communication and enabling of further automation in mobility, health and research.

R3-POWERUP will push through the new generation of 300mm Pilot Line Facility for Smart Power technology in Europe. This will enable the European industry to set the world reference of innovative and competitive solutions for critical societal challenges, like Energy saving and CO2 Reduction (ref. to COP21 Agreement ), as well as Sustainable Environment through electric mobility and industrial power efficiency. ● Development and demonstration of a brand new 300mm advanced manufacturing facility addressing a multi-KET Pilot Line (i.e. Nanoelectronics, Nanotechnology, Advanced Manufacturing) ● Improvement in productivity and competitiveness of integrated IC solutions for smart power and power discrete technologies. The strategy of the project is the following: ● The Pilot Line will enable the realization of sub-100nm Smart Power processes, starting from the 90nm BCD10 process, taking profit from the advanced and peculiar equipments available only for 300mm wafer size. ● The availability of a 300mm full processing line will also exploit the portability to 300mm of the most critical and expensive process steps devoted to power discrete devices. ● The Pilot Line will build on Digital Factory and Industry 4.0 principles, enforcing a flexible, adaptive and reliable facility, in order to investigate also the synergy and economic feasibility of supporting both Smart Power and power discrete processes in the same manufacturing line. ● The application of such technologies will be a breakthrough enabler for Energy Efficiency and CO2 Reduction worldwide, in line with COP21’s global action plan. The Pilot Line is based on three main pillars: 1. Market driven continuous innovation on smart-power and power discrete; 2. Industrial policy focused on high quality and mass production’s cost optimization; 3. Set the ground for future wafer upgrade of “More than Moore” disruptive technologies (e.g. advanced MEMS manufacturing, now at 200mm)