The last fifty years have seen spectacular progress in the ability to assemble materials with a precision of nanometers (a few atoms across). This nanofabrication ability is built upon the twin pillars of lithography and pattern transfer. A whole range of tools are used for pattern transfer. Lithography is a photographic process for the production of small structures in which structures are "drawn" in a thin radiation sensitive film. Then comes the pattern transfer step in which the shapes are transferred into a useful material, such as that of an active semiconductor device or a metal wire. Lithography is the key process used to make silicon integrated circuits, such as a microprocessor with eight billion working transistors, or a camera chip which is over two inches across. The manufacture of microprocessors is accomplished in large, dedicated factories which are limited to making one type of device. Also, normal lithography tools require the production of large, perfect and extremely expensive "negatives" so that it is only economical to use this technology to make huge numbers of identical devices. The applications of lithography are far broader than just making silicon chips, however. For example, large areas of small dots of material can be used to make cells grow in particular directions or to become certain cell types for use in regenerative medicine; The definition of an exquisitely precise diffraction grating on a laser allows it to produce the perfectly controlled wavelengths of light needed to make portable atomic clocks or to measure the tiny magnetic fields associated with the functioning of the brain; Lithography enables the direct manipulation of quantum states needed to refine the international standards of time and electrical current and may one day revolutionise computation; By controlling the size and shape of a material we can give it new properties, enabling the replacement of scarce strategic materials such as tellurium in the harvesting of waste thermal energy. This grant will enable the installation of an "electron-beam lithography" system in an advanced general-purpose fabrication laboratory. Electron beam lithography uses an electron beam rather than light to expose the resist and has the same advantages of resolution that an electron microscope has over a light microscope. This system will allow the production of the tiniest structures over large samples but does not need an expensive "negative" to be made. Instead, like a laser printer, the pattern to be written is defined in software, so that there is no cost associated with changing the shape if only one object of a particular shape is to be made. The electron beam lithography system is therefore perfect for making small things for scientific research or for making small numbers of a specialized device for a small company. The tool will be housed in a laboratory which allows the processing of the widest possible range of materials, from precious gem diamonds a few millimetres across to disks of exotic semiconductor the size of dinner plates. The tool will be used by about 200 people from all over the UK and the world. By running continuously the tool will be very inexpensive to use, allowing the power of leading-edge lithography to be used by anyone, from students to small businesses. The tool will be supported and operated by a large dedicated team of extremely experienced staff, so that the learning curve to applying the most advanced incarnation of the most powerful technology of the age will be reduced to a matter of a few weeks.

However, access to silicon prototyping facilities remains a challenge in the UK due to the high cost of both equipment and the cleanroom facilities that are required to house the equipment. Furthermore, there is often a disconnect in communication between industry and academia, resulting in some industrial challenges remaining unsolved, and support, training, and networking opportunities for academics to engage with commercialisation activities isn't widespread. The C-PIC host institutions comprising University of Southampton, University of Glasgow and the Science and Technologies Facilities Council (STFC), together with 105 partners at proposal stage, will overcome these challenges by uniting leading UK entrepreneurs and researchers, together with a network of support to streamline the route to commercialisation, translating a wide range of technologies from research labs into industry, underpinned by the C-PIC silicon photonics prototyping foundry. Applications will cover data centre communications; sensing for healthcare, the environment & defence; quantum technologies; artificial intelligence; LiDAR; and more. We will deliver our vision by fulfilling these objectives: Translate a wide range of silicon photonics technologies from research labs into industry, supporting the creation of new companies & jobs, and subsequently social & economic impact. Interconnect the UK silicon photonics ecosystem, acting as the front door to UK expertise, including by launching an online Knowledge Hub. Fund a broad range of Innovation projects supporting industrial-academic collaborations aimed at solving real world industry problems, with the overarching goal of demonstrating high potential solutions in a variety of application areas. Embed equality, diversity, and inclusion best practice into everything we do. Deliver the world's only open source, fully flexible silicon photonics prototyping foundry based on industry-like technology, facilitating straightforward scale-up to commercial viability. Support entrepreneurs in their journey to commercialisation by facilitating networks with venture capitalists, mentors, training, and recruitment. Represent the interests of the community at large with policy makers and the public, becoming an internationally renowned Centre able to secure overseas investment and international partners. Act as a convening body for the field in the UK, becoming a hub of skills, knowledge, and networking opportunities, with regular events aimed at ensuring possibilities for advancing the field and delivering impact are fully exploited. Increase the number of skilled staff working in impact generating roles in the field of silicon photonics via a range of training events and company growth, whilst routinely seeking additional funding to expand training offerings.

Southampton and Glasgow Universities currently contribute to a project entitled CORNERSTONE which has established a new Silicon Photonics fabrication capability, based on the Silicon-On-Insulator (SOI) platform, for academic researchers in the UK. The project is due to end in December 2019, after which time the CORNERSTONE fabrication capability will be self-sustaining, with users paying for the service. Based upon demand from the UK's premier photonics researchers, this proposal seeks funding to extend the capability that is offered to UK researchers beyond the current SOI platforms, to include emerging Silicon Photonics platforms, together with capabilities facilitating integration of photonic circuits with electronics, lasers and detectors. These emerging platforms enable a multitude of new applications that have emerged over the past several years, some of which are not suitable for the SOI platform, and some of which complement the SOI platform by serving applications at other wavelengths. Southampton, and Glasgow universities will work together to bring the new platforms to a state of readiness to deliver the new functionality via a multi-project-wafer (MPW) mechanism to satisfy significantly increasing demand, and deliver them to UK academic users free of charge (to the user) for the final six months of the project, in order to establish credibility. This will encourage wider usage of world class equipment within the UK, in line with EPSRC policy. We seek funding for 3 PDRAs and 2 technicians across the 2 institutions, over a 2 year period, to facilitate access to a very significant inventory of equipment at these 2 universities, including access to UK's only deep-UV projection lithography capability. During this 2 year period, we will canvas UK demand for the capability to continue to operate as an EPSRC National Research Facility, and if so, to establish a statement of need. We currently have 50 partners/users providing in-kind support to a value of to £1,705,000 and cash to the value of £173,450.

Silicon photonics is the manipulation of light (photons) in silicon-based substrates, analogous to electronics, which is the manipulation of electrons. The development cycle of a silicon photonics device consists of three stages: design, fabrication, and characterisation. Whilst design and characterisation can readily be done by research groups around the country, the fabrication of silicon photonics devices, circuits and systems requires large scale investments and capital equipment such as cleanrooms, lithography, etching equipment etc. Based at the Universities of Southampton and Glasgow, CORNERSTONE 2.5 will provide world-leading fabrication capability to silicon photonics researchers and the wider science community. Whilst silicon photonics is the focus of CORNERSTONE 2.5, it will also support other technologies that utilise similar fabrication processes, such as MEMS or microfluidics, and the integration of light sources with silicon photonics integrated circuits, as well as supporting any research area that requires high-resolution lithography. The new specialised capabilities available to researchers to support emerging applications in silicon photonics are: 1) quantum photonics based on silicon-on-insulator (SOI) wafers; 2) programmable photonics; 3) all-silicon photodetection; 4) high efficiency grating couplers for low energy, power sensitive systems; 5) enhanced sensing platforms; and 6) light source integration to the silicon nitride platform. Access will be facilitated via a multi-project-wafer (MPW) mechanism whereby multiple users' designs will be fabricated in parallel on the same wafer. This is enabled by the 8" wafer-scale processing capability centred around a deep-UV projection lithography scanner installed at the University of Southampton. The value of CORNERSTONE 2.5 to researchers who wish to use it is enhanced by a network of supporting companies, each providing significant expertise and added value to users. Supporting companies include process-design-kit (PDK) software specialists (Luceda Photonics), reticle suppliers (Compugraphics, Photronics), packaging facilities (Tyndall National Institute, Bay Photonics, Alter Technologies), a mass production silicon photonics foundry (CompoundTek), an epitaxy partner for germanium-on-silicon growth (IQE), fabrication processing support (Oxford Instruments), an MPW broker (EUROPRACTICE), a III-V die supplier (Sivers Semiconductors) and promotion and outreach partners (Photonics Leadership Group, EPIC, CSA Catapult, CPI, Anchored In). Access to the new capabilities will be free-of-charge to UK academics in months 13-18 of the project, and 75% subsidised by the grant in months 19-24. During the 2-year project, we will also canvas UK demand for the capability to continue to operate as an EPSRC National Research Facility, and if so, to establish a Statement of Need.

We live in increasingly connected world, reliant on ubiquitous digital infrastructure of increasing reach and complexity, and integration of terrestrial and space communication and sensing networks to gather, share and exchange information in a persistent way without natural barriers has already started. Higher levels of inter-reliability of the services require fast and actionable automatic assessment of physical infrastructure to detect potential anomalies. The explosive growth of Earth-orbiting satellite populations in protected LEO and GEO regions exacerbates the risk of disruption from either impact with space objects or debris, or hostile activity intended to re-purpose the satellite or its whole network using spawned objects. This research lays the foundation for a new capability for multi-perspective monitoring of dynamic environments, using quantum enabled space-borne inverse synthetic aperture radar (ISAR) imagery. It will use sub-THz scattering from multi-scale manmade objects and clusters of debris to generate a library of scattering characteristics of satellite descriptors and deployables, and develop robust deep-learning classification and recognition approaches for anomaly detection and characterization. The technology will make the most of the advantages for in-orbit monitoring from space, including: - The elimination of atmospheric absorption and attenuation, and thus the need for high power transmission to compensate for large propagation losses over large distances, inherent to ground based systems. - The shorter operational ranges and the absence of atmospheric adverse phenomena allow use of high frequencies (above 100 GHz) able to deliver unprecedented resolution of radar imagery with a compact sensor. - The diversity of accessible vantage points provided by 3D observation trajectories from space. This delivers currently missing object observation from viewing aspects not available from the ground, as well as reconstruction of multi-temporal or multi-perspective 2D and 3D imagery. The data from these multi-dimensional observations will enable end-to-end segmentation and classification, in particular, anomalies in appearance or behaviour. The project's ambitious goal is to undertake multi-disciplinary fundamental and applied studies to enable innovative sensing for space infrastructure monitoring by use of space-based multi-dimensional Inverse Synthetic Aperture Radar (ISAR) operating in the sub-terahertz region (Sub-THz). Such technology will be able to deliver co-operative Space Domain Awareness (CoSDA) based on quantum-enabled distributed space-borne radar, which can be a game changer for monitoring and protection of high value assets. The system will be able to track potential hazards, image and characterize the space residents at ranges and from aspects unavailable from Earth, and with a resolution unachievable from Earth, to deliver additional dimensionality of data to existing Space Situational Awareness (SSA) electro-optical sensors and ground-based radar (GBR). The technology builds a strong foundation for ensuring the future safety and security of highly interconnected autonomous systems.