The overall objective of the PIn3S project is to realize Pilot Integration of 3nm Semiconductor technology. This covers Process Integration, creation of Lithography Equipment, EUV Mask Repair Equipment and Metrology tools capable to deal with 3D structures, defects analysis, overlay and feature size evaluation. Each of these objectives will be achieved by cooperation between key European equipment developers like; ASML, Zeiss, Thermo Fisher, Applied Materials, Nova, KTI involved with their suppliers, involvement of a strong knowledge network based on Universities of Germany, Heidelberg University Hospital, and the Netherland, TU Delft and the University of Twente, complemented with key Technology Institutes such as imec and Fraunhofer. The project addresses Section 15 “Electronics Components & Systems Process Technology, Equipment, Materials and Manufacturing”, Major Challenge 4 “Maintaining world leadership in Semiconductor Equipment, Materials and Manufacturing solutions” and Major Challenge 1 “Developing advanced logic and memory technology for nanoscale integration and application-driven performance” of the ECSEL JU Annual Work Plan 2018. As set out in the Multi Annual Strategic Plan 2018, PIn3S addresses the ambition for the European Equipment & Manufacturing industry for advanced semiconductor technologies to lead the world in miniaturization by supplying new equipment and materials approximately two years ahead of introduction of volume production of advanced semiconductor manufacturers. With the results of the Pin3S project the consortium builds on realizing IC manufacturers to migrate to the 3nm Technology node which enables a class of new products which have more functionality, more performance and are more power efficient. As such it will form the bases for innovations yet to come enabling solutions that address the societal challenges in communication, mobility, health care, security, energy and safety & security.

The I-MECH target is to provide augmented intelligence for wide range of cyber-physical systems having actively controlled moving elements, hence support development of smarter mechatronic systems. They face increasing demands on size, motion speed, precision, adaptability, self-diagnostic, connectivity, new cognitive features, etc. Fulfillment of these requirements is essential for building smart, safe and reliable production complexes. This implies completely new demands also on bottom layers of employed motion control system which cannot be routinely handled by available commercial products. On the ground of this, the main mission of this project is to bring novel intelligence into Instrumentation and Control Layers mainly by bridging the gap between latest research results and industrial practice in related model based engineering fields. Next, I-MECH will deliver new interfaces and diagnostic data quality for System Behavior Layer. It strives to provide a cutting edge reference motion control platform for non-standard applications where the control speed, precision, optimal performance, easy reconfigurability and traceability are crucial. The high added value of I-MECH reference platform will be directly verified in high-speed/big CNC machining, additive manufacturing, semicon, high-speed packaging and healthcare robotics. In these sectors, the main project pilots will be validated. However, the platform will be applicable in many other generic motion control fields. The project outputs will impact on the entire value chain of the production automation market and, through envisioned I-MECH center, create sustainable proposition for future smart industry.