The vision of TINKER is to provide a new cost- and resource efficient pathway for RADAR and LIDAR sensor package fabrication with high throughput up to 250units/min, improved automation by 20%, improved accuracy by 50% and reliability by a factor of 100 to the European automotive and microelectronic industry via additive manufacturing and inline feedback control mechanisms. Autonomous driving and self-driving cars represent one prominent example for the use of microelectronics and sensor, most importantly RADAR and LIDAR sensors. Their respective markets have a big potential, e.g. it is estimated that the market size of LIDAR in automotive will double itself in the next two years (within 2020 to 2022). The public awareness and the industrial need for further miniaturization of such sensor packages is the main driver of ongoing efforts in the automotive sector to be able to integrate such devices into the car body like in the bumps and head lamps instead of attaching them (e.g. on top of the car in case of LIDAR device). Safety (for the driver and others) is the most important key aspect of the automotive sector. Therefore highly-value and high performance RADAR and LIDAR systems are required for advanced driver-assistance systems (ADAS) as well as robotic cars. Current bottlenecks are relevantly large size of such sensor devices, their weight and power consumption. Since these factors are highly limited within cars, further miniaturization and improving functionality and efficient use of resources is highly demanded.

Over the past 60+ years CMOS-based digital computing has giving rise to ever-greater computational performance, „big data“-based business models and the accelerating digital transformation of modern economies. However, the ever-growing amounts of data to be handled and the increasing complexity of today’s tasks for high performance computing (HPC) are becoming unmanageable as the data handling and energy consumption of HPCs, server farms and cloud services grow to unsustainable levels. New concepts and technologies are needed. One such HPC technology is Quantum computing (QC). QC utilizes so-called quantum bits (qubits) to perform complex calculations fundamentally much faster than a conventional digital-bit computers can. First quantum computer prototypes have been created. Superconducting Josephson junctions (SJJs) have been shown to be extremely promising qubit candidates to achieve a significant nonlinear increase of computational power with the number of qubits. For novel materials there is a great challenge yet opportunity in Europe to create a complete value chain for SSJs and QCs. Such a complete value chain will contribute to Europe’s technology sovereignty. The MATQu project aims at validating the technology options to produce SJJs on industrial 300 mm silicon-based process flows. It covers substrate technology, superconducting metals, resonators, through-wafer-via holes, 3D integration, and variability characterization. These will be assessed with respect to integration practices of qubits. Core substrate and process technologies with high quality factors, improved material deposition on large-substrates, and increased critical temperature for superconducting operation, will be developed and validated. The MATQu partners complement each other in an optimal way across the value chain to create a substantial competitive advantage, e.g. faster time-to-market and roll-out of technologies and materials for better Josephson junctions for quantum computing.