
MunEDA
MunEDA
8 Projects, page 1 of 2
assignment_turned_in Project2011 - 2015Partners:MunEDA, IPD, POLITO, University of Catania, Agilent Technologies (United States) +14 partnersMunEDA,IPD,POLITO,University of Catania,Agilent Technologies (United States),Agilent Technologies (Belgium),University of Nottingham,EDALab,KUL,TU/e,UCC,KEYSIGHT,ON BELGIUM,STMicroelectronics (Switzerland),ST-POLITO,STU,COVENTOR SARL,PHILIPS MEDICAL SYSTEMS NEDERLAND,IITFunder: European Commission Project Code: 288827more_vert Open Access Mandate for Publications assignment_turned_in Project2020 - 2024Partners:Lund University, EAB, TU Delft, University of Bucharest, D&R +36 partnersLund University,EAB,TU Delft,University of Bucharest,D&R,SMART IS MAKINALARI SANAYI VE TICARET ANONIM SIRKETI,RFBEAM MICROWAVE GMBH,Institut Polytechnique de Bordeaux,GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,Anteverta,Bundeswehr,FORD OTOMOTIV SANAYI ANONIM SIRKETI,MunEDA,AED,Gdańsk University of Technology,ASYGN,UCL,Sony Europe B.V.,BMVg,TUD,IMEC,Silicon Radar (Germany),STGNB 2 SAS,FHG,NI,STM CROLLES,ARBE ROBOTICS LTD,VIC,Sequans Communications (France),FLAVIA IT-Management GmbH,TURKCELL,Bundeswehr University Munich,TÜBİTAK,CEA,SILTRONIC AG,BUYUTECH TEKNOLOJI SANAYI VE TICARET ANONIM SIRKETI,MIKROELEKTRONIK LTD,MU,SOITEC,KTH,TRAXENSFunder: European Commission Project Code: 876124Overall Budget: 95,317,296 EURFunder Contribution: 24,640,000 EURThe overarching goal of BEYOND5 is to build a completely European supply chain for Radio-Frequency Electronics enabling new RF domains for sensing, communication, 5G radio infrastructure and beyond. BEYOND5 is first and foremost a technology project gathering most significant European actors covering the entire value chain from materials, semiconductor technologies, designs and components up to the systems. BEYOND5 will drive industrial roadmaps in More than Moore (MtM) in adding connectivity features on existing CMOS Technology. The ambition is to accomplish sustainable Radio Frequency SOI platforms to cover the frequency range from 0.7GHz to more than 100GHz, and to demonstrate the technical advantage of SOI, which allows combining large scale integration, low power consumption, cost competitiveness and higher reliability; thus, resulting in high volume production of trusted components with low environmental impact in Europe. This objective will be achieved in a “Time to Market” approach using the 3 major work streams: 1. Technology enhancement in three European industrial pilot lines: • 300mm RF SOI substrates pilot line in Soitec, supported by the “Substrate Innovation Center” in CEA LETI to prepare future generations. • RF-SOI 65nm pilot line for 5G FEM in ST addressing both sub-6GHz and 28GHz domains. • 22FDX pilot line addressing Digital Signal Processing of radio module and RF reliability, in GF 2. European RF design ecosystem strengthening, based on a large fabless community using FD-SOI and RF-SOI platforms 3. Six Leading edge systems aggregating the value chain to demonstrate added-value of the technology at the user level: • NB IoT for Smart Asset Tracking, • Contactless USB for high-data rate communication, • V2X for autonomous connected trucks, • 5G Low Power Digital Beamforming Base Station for Indoor dense spaces, • Automotive MIMO Radar with embedded AI, • Car Interior Radar for passenger monitoring.
more_vert - ST-POLITO,CV,FHG,CEA,MunEDA,Synopsys (United States),NXP (Germany),POLITO,Synopsys (Switzerland),IMEC,UNIBO,NXP,OFFIS EV,NXP (Netherlands),CSEM,BUTE,STMicroelectronics (Switzerland),Synopsys Armenia CJSC,IMC,GDA,Infineon Technologies (Germany),KNOWLES ELECTRONICS AUSTRIA GMBHFunder: European Commission Project Code: 248603
more_vert assignment_turned_in Project2014 - 2018Partners:ZMD, Ericsson, SORIN GROUP, IMA, TÜBİTAK +41 partnersZMD,Ericsson,SORIN GROUP,IMA,TÜBİTAK,MunEDA,WUT,EASII IC,ICDIP,ATRENTA FRANCE SAS,STGNB 2 SAS,DOCEA POWER,IGN,UTIA,METAIO,AVCR,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,UNIVERSITE BORDEAUX I,Grenoble INP - UGA,CEA,Cadence Design Systems (United States),M3S,ADR CMP,STFC,NXP,dxo labs,GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,University of Tübingen,ISD,Magillem Design Services,EADS DEUTSCHLAND GMBH,D&R,ST,AIRBUS DS SAS,IT,DXO SIG,MENTOR GRAPHICS DEVELOPMENT CROLLES SARL,FHG,TIEMPO SAS,STMicroelectronics (Switzerland),ASYGN,Dolphin Design (France),DCT,MISSING_LEGAL_NAME,Cadence Design Systems (Germany),EUROPEAN AERONAUTIC DEFENCE AND SPACE COMPANY EADS FRANCE SASFunder: European Commission Project Code: 621221more_vert assignment_turned_in Project2010 - 2014Partners:Sapienza University of Rome, STMicroelectronics (Switzerland), MunEDA, FHGSapienza University of Rome,STMicroelectronics (Switzerland),MunEDA,FHGFunder: European Commission Project Code: 251380more_vert
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