RELIANCE will develop and implement depth-resolved multimodal X-ray imaging and scattering tools that will enable the automated real-time characterization at the nano-scale of the structure and morphology of materials, devices and their manufacturing processes, reliably and with precision. Providing training in the use of these tools, as well as training in open-access science and development of transferable skills for all ESR fellows is one of the key objectives of RELIANCE. The methodologies developed by RELIANCE will be implemented for optimizing and controlling the processing of high-performance polymeric materials and composites, i.e. solution-spinning of aramid fibres, compaction-heat stretching of polyethylene film, and pultrusion of composites. RELIANCE will significantly improve quality control of a wide range of technological materials used in composite materials. Through integration of real-time data analysis and process parameters by application of machine learning, the methods will lend themselves to Industry 4.0 solutions relying on cyber physical systems for decentralized decisions based on actual, current structural properties observed during processing. The real-time access to nanostructure in the diverse applications is provided by specialized X-ray instrumentation. A shared methodology for data reconstruction and machine-learning assisted analysis exploiting prior knowledge and modelling of structural anisotropy, is applied to enable the data reduction speed required to match industrial processing. RELIANCE brings together a consortium of leading international experts in X-ray scattering, imaging and automatized analysis of scattering data, 3D reconstruction algorithms and automatized analysis of imaging data and Materials Applications, with industrial leaders in manufacturing and application of high-performance polymer materials, and in highly specialized X-ray instrumentation and scientific data acquisition and analysis.

The objective of the 3DAM project is to develop a new generation of metrology and characterization tools and methodologies enabling the development of the next semiconductor technology nodes. As nano-electronics technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges which cannot be met by pushing the present techniques to their limits. 3DAM will be a path-finding project which supports and complements several existing and future ECSEL pilot-line projects and is linked to the MASP area 7.1 (subsection More Moore). Innovative demonstrators and methodologies will be built and evaluated within the themes of metrology and characterization of 3D device architectures and new materials, across the full IC manufacturing cycle from Front to Back-End-Of-Line. 3D structural metrology and defect analysis techniques will be developed and correlated to address challenges around 3D CD, strain and crystal defects at the nm scale. 3D compositional analysis and electrical properties will be investigated with special attention to interfaces, alloys and 2D materials. The project will develop new workflows combining different technologies for more reliable and faster results; fit for use in future semiconductor processes. The consortium includes major European semiconductor equipment companies in the area of metrology and characterization. The link to future needs of the industry, as well as critical evaluation of concepts and demonstrators, is ensured by the participation of IMEC and LETI. The project will directly increase the competitiveness of the strong Europe-based semiconductor Equipment industry. Closely connected European IC manufacturers will benefit by accelerated R&D and process ramp-up. The project will generate technologies essential for future semiconductor processes and for the applications enabled by the new technology nodes.