Efforts to develop optical interfaces with Terabit capacity for datacom applications have kicked off. A practical path to the Terabit regime is to scale the current 400G modules, which are based (in the most forward looking version of the standards) on 4 parallel lanes, each operating with PAM-4 at 53 Gbaud. Scaling these modules by adding lanes looks simple, but entails challenges with respect to the fabrication and assembly complexity that can critically affect their manufacturability and cost. TERIPHIC aims to address these challenges by leveraging photonic integration concepts and developing a seamless chain of component fabrication, assembly automation and module characterization processes as the basis for high-volume production lines of Terabit modules. TERIPHIC will bring together EML arrays in the O-band, PD arrays and a polymer chip that will act as the host platform for the integration of the arrays and the wavelength mux-demux of the lanes. The integration will rely on butt-end-coupling steps, which will be automated via the development of module specific alignment and attachment processes on commercial equipment. The optical subassembly will be mounted on the mainboard of the module together with linear driver and TIA arrays. The assembly process will be based on the standard methodologies of MLNX and the use of polymer FlexLines for the interconnection of the optical subassembly with the drivers and the TIAs. Using these methods, TERIPHIC will develop pluggable modules with 8 lanes (800G capacity) and mid-board modules with 16 lanes (1.6T capacity) having a reach of at least 2 km. Compared to the 400G standards, the modules will reduce by 50% the power consumption per Gb/s, and will have a cost of 0.3 Euro/Gb/s. After assembly, the modules will be mounted on the line cards of MLNX switches, and will be tested in real settings. A study for the consolidation of the methods and the set up of a pilot assembly line in the post-project era will be also made.

The 6G-EWOC project aims to contribute to the development of future 6G-AI based networks by ending with TRL-4-level developments on critical technologies and devices for expanding the reach of 6G, especially in high mobility scenarios. It is addressing Key Societal Value indicators (KVI) defined by the Work Programme and developing KV enablers such as services for coordination, precise positioning and localization, multi-agent supporting network architecture and joint communication and sensing. The three ambitions of 6G-EWOC focus on: AMB1, Optical Wireless Communications (OWC) for V2V and high-rate (Gb/s) V2I applications, chip-scale optical beamformers, and developing connected laser/radio detection, ranging, and communication (Lidar/Radar). AMB2, PIC and ASIC for tuneable transmitter and receiver concepts for fiber-based fronthaul supporting 50 Gbps and 100 Gbps per wavelength over DWDM fiber links and SDN-enabled photonic switching. AMB3 focuses on AI-assisted control and orchestration of resources for the multi-band, heterogeneous 6G-EWOC network concept and AI-based applications development for autonomous vehicles. Up to 17 KPIs are expected to be validated at three final demonstrations. In conclusion, 6G-EWOC search to develop an AI-enhanced fibre-wireless optical 6G network in support of connected mobility by creating a new access network for high mobility scenarios and expanding the reach of 6G through the integration of optical and wireless technologies, free space optics, and joint communication and sensing. It is supported by a fast, reconfigurable, highly dynamic, and customizable optical fiber fronthaul infrastructure, minimizing optoelectronic transitions by tuneable and programmable devices and low energy photonic switching of (packet/optical) spectrum and spatial resources, controlled by AI-based SDN. Providing end-to-end connectivity between AI-based edge computation units supporting connected mobility in a fast reconfigurable network architecture.