
HQ-Dielectrics (Germany)
HQ-Dielectrics (Germany)
7 Projects, page 1 of 2
Open Access Mandate for Publications and Research data assignment_turned_in Project2025 - 2028Partners:SCREEN SPE GERMANY GMBH, Robert Bosch (Germany), PICOSUN OY, SOITEC, THERMO ONIX LTD +48 partnersSCREEN SPE GERMANY GMBH,Robert Bosch (Germany),PICOSUN OY,SOITEC,THERMO ONIX LTD,Mersen (France),STMicroelectronics (Switzerland),FHG,CENTROTHERM CLEAN SOLUTIONS GMBH,University of Catania,University of Leicester,University of Malta,ICRA,Arkema (France),GASERA,MOLYMEM LIMITED,CEA,FEI,AALTO,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,AIXTRON SE,CS CLEAN SOLUTIONS GmbH,TOKYO ELECTRON EUROPE LIMITED,VARIOLYTICS GMBH,ISL,THERMO FISHER SCIENTIFIC (BREMEN) GMBH,UCC,HQ-Dielectrics (Germany),LAYERONE AS,UCL,WEEECYCLING,MERCK ELECTRONICS KGAA,Pfeiffer Vacuum (France),Polytechnic University of Milan,LEONARDO,Infineon Technologies (Germany),University of Rome Tor Vergata,NXP (Netherlands),EDWARDS LTD,SEMI Europe,IMEC,PIBOND,Pfeiffer Vacuum (Germany),STM CROLLES,ST,SINTEF AS,STMicroelectronics (Malta),SCHMIDT + HAENSCH GMBH & CO,FATH GMBH,TechnipFMC (France),Besi Netherlands BV,VOCSENS,TNOFunder: European Commission Project Code: 101194246Overall Budget: 46,626,100 EURFunder Contribution: 13,965,000 EURGENESIS, backed by Horizon Europe, aims to make semiconductor manufacturing sustainable, aligning with the European Green Deal, by minimizing environmental impact with eco-friendly innovations. [Objectives] GENESIS aims to replace harmful materials with safer options, improve waste management, and enhance the use and recyclability of scarce materials. [Innovations] GENESIS introduces innovations in three key areas: • Innovative materials: PFAS-free polymer and eco-friendly gas alternatives complying with EU regulations. • Waste & emissions monitoring: Cutting-edge sensors detect hazardous substances for efficient aqueous and gas waste elimination, reducing environmental and health risks. • Scarce material management: New integration technologies optimize material usage and initiate recycling of scarce materials like Gallium, Niobium, and silicon carbide. [Methodology] GENESIS employs four technical work packages to research sustainable material substitution, emission reduction, and resource management. This modular approach promotes scalability and integration with existing processes, fostering a circular economy in the semiconductor sector. Supervised by management work packages, it quantifies environmental efficiency and engages in dissemination to promote European technological achievements [Outcomes] The project targets a 50% cut in hazardous materials, 30% decrease in emissions and waste, and improved scarce material recyclability, boosting EU semiconductor sustainability and global competitiveness. [Impact] GENESIS supports EU's tech sovereignty and resilience through accurate monitoring and sustainable practices. It positions Europe as a leader in sustainable semiconductor tech, setting new standards for impact-oriented communication and dissemination.
more_vert assignment_turned_in Project2010 - 2013Partners:Landshut Silicon Foundry, adixen, TPI, GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, RMT +36 partnersLandshut Silicon Foundry,adixen,TPI,GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,RMT,FHWN,MEMC,SUSS MICROOPTICS,SunEdison (United States),ICN2,Protec Carrier Systems GmbH,NANDA TECHNOLOGIES GMBH,Oxford Instruments (Germany),RF SUNY ,Ams AG,SUSS MicroTec (Germany),SUSS MicroTec Lithography GmbH,JO AT,Metryx,SOITEC,ICT Integrated Circuit Testing GmbH,Infineon Technologies (Germany),SUSS MicroTec Photomask Equipment,LAM RESEARCH AG,KLA,ACP,Mapper Lithography (Netherlands),IMEC,FHG,AMIL,STM CROLLES,MIY,Oxford Instruments (United Kingdom),SILTRONIC AG,Ibs (France),SEMILAB ZRT,CEA,Intel (United States),PVA-AS,HQ-Dielectrics (Germany),FRT GmbHFunder: European Commission Project Code: 257379more_vert assignment_turned_in Project2012 - 2015Partners:FHG, TUW, HQ-Dielectrics (Germany), ASML (Netherlands), GSS +5 partnersFHG,TUW,HQ-Dielectrics (Germany),ASML (Netherlands),GSS,Excico France,Ams AG,Ibs (France),University of Glasgow,LASER SYSTEMS & SOLUTIONS OF EUROPEFunder: European Commission Project Code: 318458more_vert assignment_turned_in Project2012 - 2015Partners:Semilev, AIS, SAGIVTECH, ASMI NV, HERAEUS HOLDING GMBH +27 partnersSemilev,AIS,SAGIVTECH,ASMI NV,HERAEUS HOLDING GMBH,AMIL,LAM RESEARCH AG,KLA,Recif Technologies (France),ART,NVMI,INTEL IRELAND,Jordan Valley Semiconductors (Israel),Royal NLR,HQ-Dielectrics (Germany),Levitech,M+W GERMANY GMBH,Edwards Ltd,FHG,IMEC,EVG,ASML (Netherlands),PHILIPS ELECTRONICS NEDERLAND B.V.,ICT Integrated Circuit Testing GmbH,NANDA TECHNOLOGIES GMBH,Infinitesima Ltd,FEI,ASYS,OINT,XYCARB CERAMICS BV,SILTRONIC AG,TNOFunder: European Commission Project Code: 304712more_vert Open Access Mandate for Publications assignment_turned_in Project2018 - 2023Partners:NANODESIGN, University of Bucharest, Ikerlan, STMICROELECTRONICS SILICON CARBIDE AB, DACPOL SP. Z O.O. +26 partnersNANODESIGN,University of Bucharest,Ikerlan,STMICROELECTRONICS SILICON CARBIDE AB,DACPOL SP. Z O.O.,algoWatt,IUNET,STMicroelectronics (Switzerland),APPLIED MATERIALS IRELAND LIMITED,IPD,LPE,II-VI GMBH,AMIL,JSR MICRO NV,CNR,CENTROTHERM INTERNATIONAL AG,EVG,APPLIED MATERIALS GMBH,APPLIED MATERIALS ITALIA SRL,EVATEC AG,University of Zaragoza,UNIPA,FORES,STU,LAM,ELFOREST AB,Disco (Germany),SIEC BADAWCZA LUKASIEWICZ - INSTYTUT MIKROELEKTRONIKI I FOTONIKI,HQ-Dielectrics (Germany),MIUN,LAM RESEARCH SASFunder: European Commission Project Code: 783158Overall Budget: 49,767,700 EURFunder Contribution: 10,402,000 EURREACTION will push through the first worldwide 200mm Silicon Carbide (SiC) Pilot Line Facility for Power technology. This will enable the European industry to set the world reference of innovative and competitive solutions for critical societal challenges, like Energy saving and CO2 Reduction as well as Sustainable Environment through electric mobility and industrial power efficiency. Establishing the first 200mm SiC Pilot Line in the world and developing the most innovative and cost competitive technology, this project will address mass-market applications like smart energy and smart mobility, and industrial. It will allow to meet the more and more increasing demand of requirements in terms of quality and cost constraint for next decade generation’s power electronics. The Project strength is the complete Pilot Line value chain implementation, integrating and optimizing partnership in the fields of SiC equipment developers, SiC process technologists, RTOs, and end users partners till the final applications context. This will allow to develop a full 8” SiC line ecosystem enhancing the competitiveness of EU- Industries down to the value chain in a market context where other countries today, such as the USA or Japan, are just starting to play on 6” SiC market. Innovative SiC power device Performances improvements, together with cost and size reductions, are the most relevant challenges addressed in the project that are expected to lead to a new stronger European supply chain for very compact SiC converters, from 600V to 2.2kV range, ideal for the addressed applications; the ambition is therefore to play a primary role towards excellence in Europe by a first generations of 8” SiC profitable Smart Mobility and Smart Energy products and components, primary access to IPs for the relevant essential capabilities, competitiveness of manufacturing in Europe.
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