
INNATERA NANOSYSTEMS BV
INNATERA NANOSYSTEMS BV
8 Projects, page 1 of 2
Open Access Mandate for Publications and Research data assignment_turned_in Project2023 - 2025Partners:TU/e, AAU, NVIDIA GmbH, GOLFE ENGINEERING, INNATERA NANOSYSTEMS BV +16 partnersTU/e,AAU,NVIDIA GmbH,GOLFE ENGINEERING,INNATERA NANOSYSTEMS BV,UCC,NATIONAL TECHNICAL UNIVERSITY OF ATHENS - NTUA,Mellanox Technologies (Israel),Dresden University of Applied Sciences,BMW (Germany),CNIT,ECCENCA,VIRAGE LOGIC,AGRICOLOUS,EISI,CORTUS,ITALTEL S.P.A.,Conti,FHG,University of Hannover,SSSAFunder: European Commission Project Code: 101097560Overall Budget: 14,974,700 EURFunder Contribution: 4,497,180 EURCLEVER proposes a series of innovations in the area of hardware accelerators, design stack, and middleware software that revolutionize the ability of edge computing platforms to operate federatedly, leveraging sparse resources that are coordinated to create a powerful swarm of resources. CLEVER technologies will support the deep edge computing paradigm, moving computing services closer to the end user or the source of the data to reduce power consumption, reduce capacity requirements, and latency for mission critical applications. Furthermore, CLEVER will overcome traditional limitations of edge computing in terms of limited resource availability by providing an effective framework for seamless use of federated resources in the edge-cloud continuum. CLEVER will demonstrate processing solutions for AI at the edge through four use cases: (1) digital twin for in-factory optimization, (2) smart agriculture for high yield eco-farms, (3) fully automated material deployment, and (4) augmented reality for shopping sites. Through the achievement of its goals, the CLEVER project will help to position Europe at the forefront of the intelligent edge computing field, enabling growth across many sectors (manufacturing, agriculture, smart environments, augmented reality, and others). By lowering the barriers for utilising edge computing for artificial intelligence applications, CLEVER will open the door for European Industries and SMEs to leverage state of the art technologies, driving their development and growth as leaders in their sectors.
more_vert Open Access Mandate for Publications and Research data assignment_turned_in Project2024 - 2027Partners:TÜBİTAK, UNIMORE, HEMA ENDUSTRI AS, TH Köln – University of Applied Sciences, SMARTSOL SIA +36 partnersTÜBİTAK,UNIMORE,HEMA ENDUSTRI AS,TH Köln – University of Applied Sciences,SMARTSOL SIA,INNATERA NANOSYSTEMS BV,Latvian Academy of Sciences,CSIC,TOP DATA SCIENCE OY,BYLOGIX,IECS,Velti GMBH,AITEK SPA,IMEC,AVL,ANYWI,HTEC GMBH,TOFAS,ROVIMATICA,SIILI AUTO OY,TTTECH AUTO AG,OYAK RENAULT OTOMOBIL FABRIKALARI AS,DANISI ENGINEERING SRL,IDNEO,POLITO,SMART CONTROL SYSTEMS AND SOFTWARE JOINT STOCK COMPANY,IOTAM INTERNET OF THINGS APPLICATIONS AND MULTI LAYER DEVELOPMENT LTD,FREQUENTIS,Infineon Technologies (Germany),SANLAB SIMULASYON AR. GE. SAN. TIC. A.S.,INFINEON TECHNOLOGIES DUISBURG GMBH& CO. KG,IDEAS & MOTION SRL,HAROKOPIO UNIVERSITY OF ATHENS (HUA),Infineon Technologies (Austria),AIT,TU Delft,UAM,TTTech Germany GmbH,INNOVATION DIS.CO PRIVATE COMPANY,TAMPERE UNIVERSITY,NOKIA TECHNOLOGIESFunder: European Commission Project Code: 101139996Overall Budget: 33,956,400 EURFunder Contribution: 10,016,600 EURShapeFuture will drive innovation in fundamental Electronic Components and Systems (ECS) that are essential for robust, powerful, fail-operational and integrated perception, cognition, AI-enabled decision making, resilient automation and computing, as well as communications, for highly automated vehicles. Its overarching vision is to bring ECS Innovation at the Heart of Europe's Mobility Transformation, thereby elevating Sovereignty by Perfecting Programmable ECS Solutions for Intelligent, Safe, Connected, and Highly Automated Vehicles. The project will result in the following main tangible outcomes: • Safety, security and reliability of in-vehicle systems to levels appropriate for mass-market deployment. • Availability and supply of leading-edge ECS for the European automotive supply chain and for OEMs to be at the forefront of technology developments in the 2030s. • Increased Accuracy and Robustness of ECS for perception with smaller form factors and lower power consumption. • ECS attributed with cognition features and improved human-Machine Interface (HMI). • ECS with cognitive processing and decision-making capabilities. • ECS for resilient automation and communications. • Increased technology acceptance that will also lead to business sovereignty safeguard. 15 demonstrators and 2 impact studies will showcase the project’s achievements and their capability to deliver innovations and secure future application advances in core markets for European society – Mobility, Green Deal, Digital Society, Safety and Industry. The project innovations will leverage the expertise of world-renowned industrial (5 OEMs, 24 Tier-1, Tier-2 and technology providers) and 12 research partners along the complete automotive and semiconductor value chains, providing Europe with a competitive edge in a growing market. Importantly, ShapeFuture will contribute to ensuring European ECS Sovereignty by shaping the future of ECS in mobility.
more_vert Open Access Mandate for Publications and Research data assignment_turned_in Project2025 - 2028Partners:DTU, IUNET, AMU, FOI, ST +61 partnersDTU,IUNET,AMU,FOI,ST,TECHNEXT,ThingLink,UTIA,IMMS GMBH,DANFOSS POWER ELECTRONICS AS,WEEBIT NANO,HALTIAN,IMA,SORAMA,KOVILTA OY,GEOSYSTEMS HELLAS IT KAI EFARMOGESGEOPLIROFORIAKON SYSTIMATON ANONIMIETAIREIA,TÜBİTAK,APPLIED MATERIALS ITALIA SRL,FRAUNHOFER,STRIKERSOFT,CEA,STGNB 2 SAS,INNATERA NANOSYSTEMS BV,ISD,UGA,STMicroelectronics (Switzerland),TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,RICCA IT,X-FAB Dresden,UNITY-SC,IT,EMMTRIX,PICOSUN OY,IRNOVA,SOITEC,IFEVS,Pfeiffer Vacuum (France),ALMENDE,UAB,UoA,Aristotle University of Thessaloniki,THALES DIS FRANCE SAS,UEF,Technische Universität Braunschweig,KTH,UPRC,GN STORE NORD,IMEC-NL,XGS,MICRO-SENSYS GMBH,TU Delft,TU Darmstadt,University of Seville,University of Twente,UGA,PT PORTUGAL TELECOM MEO,LOCSENSE B.V.,STM CROLLES,MARULLO SPA,University of Piraeus,KNOWTION GMBH,ENDIIO ENGINEERING GMBH,UNIPV,CAS,Grenoble INP - UGA,FHGFunder: European Commission Project Code: 101194172Overall Budget: 95,629,000 EURFunder Contribution: 25,010,700 EUREurope is poised to play a pivotal role in the technological revolution, particularly in the field of edge AI, which promises sustainable growth, performance, and reliability. The NeAIxt project is a strategic initiative designed to foster European independence and control over edge AI technology, benefiting both companies and citizens. The project presents a golden opportunity for European SMEs to grow, network, and enhance skills, leveraging exposure to the global market. Research labs and RTOs will bridge the gap to the future by developing necessary technologies and competencies, while universities will cultivate and disseminate advanced skills required for this technological evolution. NeAIxt aims to solidify Europe's position in edge AI and eNVM technology by enhancing AI enablers, evolving eNVM for edge applications, and demonstrating AI capabilities at both chip and system levels. The project is committed to ensuring the safety and security of AI services, adhering to EU regulations. Key technical developments include the advancement of 18nm FD-SOI and next-generation embedded Phase Change Memory (ePCM). These innovations will lead to high-performance, secure microcontrollers with AI capabilities, offering low power consumption and high security for smart applications. The project will integrate advances in non-volatile memory technologies with cutting-edge MCU design to enable efficient in-memory computing. This synergy will deliver a fully European solution for reliable, safe, and independent edge AI applications. NeAIxt will address the entire edge AI value chain, from academia to industry, and from design to end-user applications, building on Europe's strong technological foundation. The project's outcomes will alleviate societal concerns about AI proliferation by ensuring compliance with European privacy standards, fostering AI adoption in various sectors.
more_vert Open Access Mandate for Publications assignment_turned_in Project2021 - 2024Partners:UGR, SIRRIS, TST, IMA, MDH +44 partnersUGR,SIRRIS,TST,IMA,MDH,DANFOSS POWER ELECTRONICS AS,SESTEK SES VE ILETISIM BILGISAYAR TEKNOLOJILERI SANAYI TICARET ANONIMSIRKETI,AKIM METAL SANAYI VETICARET AS,[no title available],Schneider Electric (Spain),IT,University of Lübeck,mediri GmbH,PDM&FC,ANYWI,JSI,SEVEN SOLUTIONS SL,Technical University of Liberec,INNATERA NANOSYSTEMS BV,STEP SOLUTIONS AS,ESC AEROSPACE GMBH,DTU,ALMENDE,University of Siegen,G&D,TU Delft,KOALA TECH LDA,Arctos Labs Scandinavia AB,XAL,OCTAVIC PTS APS,TPV AUTOMOTIVE d.o.o.,BUT,COSYLAB,GRADIANT,GS,RISE,BEYOND VISION - SISTEMAS MOVEIS AUTONOMOS DE REALIDADE AUMENTADA LDA,TU/e,SENSATIVE AB,Jotne,VESTEL ELEKTRONIK SANAYI VE TICARET ANONIM SIRKETI,EVENTIGRATE,NXP (Netherlands),IMEC-NL,Tieto,UC,NXP (Germany),FHG,ITIFunder: European Commission Project Code: 101007273Overall Budget: 32,726,200 EURFunder Contribution: 9,811,060 EURThe use of artificial intelligence (AI) in Edge computing is entering a new era based on the use of ubiquitous small and connected devices. Until now, Europe has not been doing well, as America sets the standards and most components are produced in Asia or America. This project believes doing better is realized by (1) Putting European values of self-organization, privacy by design and low use of energy in the core of the Edge Computing components that shape this new era, and delivering the technology needed to promote these values; (2) Focusing on pan European cooperation to ramp up the capabilities needed to deliver these new components at a scale that can make a real impact. Europe does not have huge IT leaders so cooperation from a very early phase is key. All partners in the project participate in delivering key parts of these new Edge Computing components; and (3) Demonstrating the use of these components in key European industrial areas. Clear and early examples are needed to un-lock corporate and external funding to deliver on the promise of this very exciting project. The DAIS project will research and deliver distributed artificial intelligent systems. It will not research new algorithms, as such, but solves the problems of running existing algorithms on these vastly distributed edge devices that are designed based on the above three European core values. The research and innovation activities are organized around eight complementary and mutually supportive supply chains. Five of these focus on delivering the hardware and software that is needed to run industrial-grade AI on different types of networking topologies. Three of the supply chains demonstrate how known AI challenges, from different functional areas, are met by this pan European effort. The DAIS project consists of 48 parties from 11 different countries. The DAIS project fosters cooperation between large and leading industrial players from different domains.
more_vert Open Access Mandate for Publications assignment_turned_in Project2020 - 2023Partners:Royal NLR, ROBONIK MEKATRONIK TEKNOLOJILERI DANISMANLIK SANAYI VE TICARET LIMITEDSIRKETI, AIRHOLDING S.A., Katam (Sweden), TÜBİTAK +46 partnersRoyal NLR,ROBONIK MEKATRONIK TEKNOLOJILERI DANISMANLIK SANAYI VE TICARET LIMITEDSIRKETI,AIRHOLDING S.A.,Katam (Sweden),TÜBİTAK,TU Delft,ALTUS,Infineon Technologies (Austria),Syrphus GmbH,ANYWI,INFINEON TECHNOLOGIES ITALIA Srl,RUB,HFC,TURKISH AEROSPACE INDUSTRIES TAI,UNIPR,Avular B.V.,Graz University of Technology,Bauhaus Luftfahrt,TECHNOLUTION BV,MAXIMATECC,ESC AEROSPACE GMBH,SYSGO AG,EAB,Lund University,ALMENDE,AAU,Infineon Technologies (Germany),ISEP,IOTAM INTERNET OF THINGS APPLICATIONS AND MULTI LAYER DEVELOPMENT LTD,CEA,INNATERA NANOSYSTEMS BV,TTTech Computertechnik (Austria),IUNET,SMART IS MAKINALARI SANAYI VE TICARET ANONIM SIRKETI,VIF,TURKCELL,TAMPERE UNIVERSITY,NXP (Netherlands),CISC Semiconductor (Austria),HAROKOPIO UNIVERSITY OF ATHENS (HUA),FREQUENTIS,BMVg,UAB,Bundeswehr University Munich,BUYUTECH TEKNOLOJI SANAYI VE TICARET ANONIM SIRKETI,CTG,FORD OTOMOTIV SANAYI ANONIM SIRKETI,NOKIA TECHNOLOGIES,FHG,UAM,G&DFunder: European Commission Project Code: 876019Overall Budget: 41,399,600 EURFunder Contribution: 11,869,500 EURADACORSA targets to strengthen the European drone industry and increase public and regulatory acceptance of BVLOS (beyond visual line-of-sight) drones, by demonstrating technologies for safe, reliable and secure drone operation in all situations and flight phases. The project will drive research and development of components and systems for sensing, telecommunication and data processing along the electronics value-chain. Additionally, drone lead smart industries with high visibility and place for improvement will be developed which will pave the way for a higher public / industry acceptance of the drone technologies. In particular, ADACORSA will deliver: a) On the component level, functionally redundant and fail-operational radar and LiDAR sensors as well as 3D cameras. In order to reduce risk, time and costs, the project aims to adapt technologies from the automotive sector to the drone market for these components. b) On the system level, hardware and software for reliable sensor fusion and data analytics as well as technologies for secure and reliable drone communication using multipath TCP and registration and identification by developing platforms based on eUICCs/eSIM. c) On an architecture level, fail-operational drone control and investigation a pre-operational Flight Information Management System (FIMS) the integration with CoTS components for Unmanned Air Vehicle Traffic Management System (UTM). Within the project, 35 physical as well as virtual demonstrators of BLVOS, long-range drone flight shall pave the way toward certifiable systems for future integration of drone operations. ADACORSA's innovations will leverage the expertise of a very strong consortium, comprising world renowned industrial (OEMs, Tier-1, Tier-2 and technology providers) and research partners along the complete aviation, semiconductor and also automotive value chains, providing Europe with a competitive edge in a growing drone and drone technologies market.
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