Efforts to develop optical interfaces with Terabit capacity for datacom applications have kicked off. A practical path to the Terabit regime is to scale the current 400G modules, which are based (in the most forward looking version of the standards) on 4 parallel lanes, each operating with PAM-4 at 53 Gbaud. Scaling these modules by adding lanes looks simple, but entails challenges with respect to the fabrication and assembly complexity that can critically affect their manufacturability and cost. TERIPHIC aims to address these challenges by leveraging photonic integration concepts and developing a seamless chain of component fabrication, assembly automation and module characterization processes as the basis for high-volume production lines of Terabit modules. TERIPHIC will bring together EML arrays in the O-band, PD arrays and a polymer chip that will act as the host platform for the integration of the arrays and the wavelength mux-demux of the lanes. The integration will rely on butt-end-coupling steps, which will be automated via the development of module specific alignment and attachment processes on commercial equipment. The optical subassembly will be mounted on the mainboard of the module together with linear driver and TIA arrays. The assembly process will be based on the standard methodologies of MLNX and the use of polymer FlexLines for the interconnection of the optical subassembly with the drivers and the TIAs. Using these methods, TERIPHIC will develop pluggable modules with 8 lanes (800G capacity) and mid-board modules with 16 lanes (1.6T capacity) having a reach of at least 2 km. Compared to the 400G standards, the modules will reduce by 50% the power consumption per Gb/s, and will have a cost of 0.3 Euro/Gb/s. After assembly, the modules will be mounted on the line cards of MLNX switches, and will be tested in real settings. A study for the consolidation of the methods and the set up of a pilot assembly line in the post-project era will be also made.

Photonics is a key enabling technology in the realization of modern medical devices with applications ranging from diagnostics to personalised monitoring and therapeutics. Characteristic nature of both photonics and medical applications is high diversity. Therefore, the more widespread use of photonics technologies in scattered ecosystems presents major challenges for the technological values chains comprising end-user companies and manufacturers. In conjunction with highly regulated validation and production processes, the timespan from the proof-of-concept to product launch takes years causing high costs. Relying on existing pilot line concept, PhotonMed aims at accelerated uptake of the latest photonics technologies in medical device applications. PhotonMed project is applied to continuously renew the technology offering of photonics pilot line and to invite new members and countries to join the ecosystem. Within research-oriented PhotonMed project RTOs and industrial parties can develop their technology offering while the end-user companies get matured demonstrators based on the latest research results.

PIXAPP will establish the world’s first open access Photonic Integrated Circuit (PIC) assembly & packaging Pilot Line. It combines a highly-interdisciplinary team of Europe’s leading industrial & research organisations. PIXAPP provides Europe’s SMEs with a unique one-stop-shop, enabling them to exploit the breakthrough advantages of PIC technologies. PIXAPP bridges the ‘valley of death’, providing SMEs with an easy access route to take R&D results from lab to market, giving them a competitive advantage over global competition. Target markets include communications, healthcare & security, which are of great socio-economic importance to Europe. PIXAPP’s manufacturing capabilities can support over 120 users per year, across all stages of manufacturing, from prototyping to medium scale manufacture. PIXAPP bridges missing gaps in the value chain, from assembly & packaging, through to equipment optimisation, test and application demonstration. To achieve these ambitious objectives, PIXAPP will; 1) Combine a group of Europe’s leading industrial & research organisations in an advanced PIC assembly & packaging Pilot Line facility.2) Develop an innovative Pilot Line operational model that coordinates activities between consortium partners & supports easy user access through a single entry point. 3) Establish packaging standards that provide cost-efficient assembly & packaging solutions, enabling transfer to full-scale industrial manufacture. 4) Create the highly-skilled workforce required to manage & operate these industrial manufacturing facilities.5) Develop a business plan to ensure Pilot Line sustainability & a route to industrial manufacturing. PIXAPP will deliver significant impacts to a wide stakeholder group, highlighting how industrial & research sectors can collaborate to address emerging socio-economic challenges.

Advances in optoelectronics technologies is causing a revolution in consumer electronic goods, solar energy, communications, LED, industrial laser, and other fields. At present, the optoelectrical manufacturing is facing significant challenges in dealing with the evolution of the equipment, instrumentation and manufacturing processes they support. The industry is striving for higher customisation and individualisation, implying that systems configurations need to change more frequently and dynamically. IQONIC will offer a scalable zero defect manufacturing platform covering the overall process chain of optoelectrical parts. IQONIC covers the design of new optoelectrical components and their optimised process chain, their assembly process, as well as their disassembly and reintroduction into the value chain. IQONIC will therefore comprise new hardware and software components interfaced with the current facilities through internet of things and data-management platforms, while being orchestrated through eight (8) scalable strategies at component, work-station and shopfloor level. The IQONIC technologies will be demonstrated in 4 demo sites covering a wide range of products and processes. The impact of IQONIC to the European optoelectronics manufacturing industry, but also the society itself, can be summarised in the following (with a horizon of 4 years after project ends): (i) increase of the in-service efficiency by 22%, (ii) increased flexibility with 16% faster reconfiguration times, (iii) 10% reduction in production costs through recycled components and materials, (iv) improved designs for assembly and disassembly and, (v) about 400 new jobs created and (vi) over 39 MEUR ROI for the consortium. To do that we have brought together a total of seventeen (17) EU-based partners, representing both industry and academia, having ample experience in cutting-edge technologies and active presence in the EU photonics and manufacturing.