The EFESOS project aims to develop and evaluate a cutting-edge ASIC technology for space applications. More specifically, departing from the characterization of the commercial technology, a radiation-hardened-by-design digital library and a set of complex analog IP cores (ADC, DAC, SERDES and PLL) will be implemented using the 22FDX process from Global Foundries, available at their production facility in Dresden (Germany). A complete electrical, environmental (radiation) and reliability validation of the technology will be performed, and the resulting fully-European design flow will be evaluated according to the ESCC standards with a representative sample chip. The 22FDX is a 22nm Fully-Depleted SOI technology providing up to 40% die scaling relative to the standard 28nm node, nearly 70% lower power than 28nm and similar power efficiency to FinFET technology. EFESOS responds to the increasing demand of the European space industry of more integrated ASICs at higher performance, and greatly contributes to the strategic goal of achieving non-dependence on critical technologies. The project will provide Europe with a technical capability beyond the current state-of-the-art, thus becoming a global reference in space microelectronics.

MULTI-FUN sets a clear focus on market-creating innovation, developing advanced materials and equipment for Additive Manufacturing of multi-material parts. These new material combinations will provide a significant performance & efficiency gain in MAM products by fully integrated multi-functionalities based on novel active materials and enable MULTI-MATERIAL design in geometrically complex 3D metal parts without size limitations by innovative, cost-effective AM technologies. The novel integrated functionalities include embedded electrical conductivity, fibre-optical sensing features or innovative heat management concepts, incl. applying nanotechnologies in at least 3 variants. Leading experts in AM process & equipment manufacturing (from SMEs, IND, RTOs and UNIV) will fully cover the physical integration of these advanced materials into metallic substrates. Significant improvements in efficiency, quality & reliability of products will result in KPI numbers beyond the request (>40%), alongside reduced environmental impact as well as lower costs also much better than the given number of >35%. The evaluation assessment (reg. general performance & quality of novel functionalities) and LCA will be performed on 7 industrial demonstrators, addressing structural parts, moulds and test equipment for aerospace, automotive and general industrial usage. By wide usage of cost-effective wire & arc-based AM systems, complemented by efficient powder processing methods (esp. thin multi-material features), market uptake will be benefited, esp. for SMEs. MULTI-FUN includes 9 EU SMEs as key players in advanced materials research for AM, providing a great opportunity to accelerate market uptake. Stakeholder involvement (e.g. reg. Certification & Standardization) will foster business models & marketing of strong USPs of MULTI-FUN.